Mega Idea BZ26 Universal Stencil 0.3/0.35/0.4/0.5 BGA Reballing Stencil
₨850.00
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Description
Key Specifications
- Hole Sizes: Supports four common ball diameters: 0.3mm, 0.35mm, 0.4mm, and 0.5mm.
- Hole Patterns: Features parallel, 45-degree, and dislocation hole layouts to accommodate various chip designs.
- Material: Crafted from high-quality stainless steel with a standard 0.12mm thickness.
- Heat Resistance: Designed to withstand high temperatures (up to 105°C), allowing for direct heating during the reballing process without removing the stencil.
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