Goot SE-76006 0.6MM 70G High-Density Mounting Lead Solder

SKU: SE-76006 0.6MM

5,000.00

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Description

  • Composition: 60% Tin (Sn) and 40% Lead (Pb).
  • Melting Point:

    183–190∘C183 — 190 raised to the composed with power C

    183–190∘C

    .

  • Wire Diameter:

    0.6 mm0.6 mm

    0.6 mm

    .

  • Length: Approximately

    34 meters34 meters

    34 meters

    (

    70g70 g

    70g

    ).

  • Features: Made in Japan, activated rosin core, suitable for high-density soldering on circuit boards.

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