2UUL BH04 MICRO JIG IC Mini Tempered Insulated Glass Fixture for Mobile Phone Motherboard Repair

SKU: BH04

4,500.00

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Description

Technical Specifications
Specification  Detail
Model Number BH04
Material / Base Tempered borosilicate glass base + 6061 aluminum frame
Dimensions 80 mm × 60 mm × 12 mm (ultra-slim profile)
Weight Approximately 120g (actual weight may vary by retailer, up to 0.5 kg listed)
Chip Size Support 1.5×1.5 mm to 8×8 mm
Clamping Mechanism Rotary-shaft locking clamp, no rebound
Adjustable Levels Clamp position is adjustable at high, middle, and low levels
Application Universal mobile phone motherboard and IC repair fixture

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