Goot SE-76006 0.6MM 70G High-Density Mounting Lead Solder
₨5,000.00
15
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Description
- Composition: 60% Tin (Sn) and 40% Lead (Pb).
- Melting Point:
183–190∘C183 — 190 raised to the composed with power C
183–190∘C
.
- Wire Diameter:
0.6 mm0.6 mm
0.6 mm
.
- Length: Approximately
34 meters34 meters
34 meters
(
70g70 g70g
).
- Features: Made in Japan, activated rosin core, suitable for high-density soldering on circuit boards.
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